Early renders of the Google Pixel 11 have surfaced, offering a detailed look at the upcoming flagship ahead of its expected August debut. The images, shared by tipster @OneLeaks (via Android Headlines), point to a design that largely builds on its predecessor while introducing subtle refinements.
The device is reported to measure 152.8 x 72 x 8.5mm and is expected to feature a 6.3-inch LTPO AMOLED display. The overall footprint remains close to the Pixel 10, suggesting minimal changes in size and form factor. Flat sides continue to define the design, while the signature rear camera bar appears slightly larger but thinner. The triple rear camera layout remains intact.
Under the hood, the Pixel 11 is expected to run on Google’s next-generation Tensor G6 processor. The chipset is said to adopt a 7-core architecture and will reportedly be manufactured using TSMC’s 2nm process. The device may also mark a shift in connectivity hardware, replacing Samsung’s modem with a new MediaTek M90 modem.
Security is another area of upgrade. The phone is expected to feature a new Titan M3 security coprocessor, internally referred to as “Google Epic,” replacing the Titan M2 used in previous Pixel devices.
In terms of memory and storage, the Pixel 11 is likely to offer 12GB of RAM, with storage options starting at 128GB and going up to 256GB. There is also speculation that Google could increase the base storage to 256GB, in line with trends seen in recent flagship releases.
The device is expected to run Android 17 out of the box. On the camera front, new software-driven features are rumored, including an ultra-low-light video mode with on-device processing. This would allow high-quality video capture in dark conditions without relying on cloud processing. Additional features may include Cinematic Blur at 4K 30 fps and a video relight tool for adjusting lighting in recorded footage.
A 5,000mAh battery is also expected. Pricing is rumored to start at $799, similar to the previous model.
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